Intel has reportedly expanded its orders for ASML’s High Numerical Aperture (High-NA) EUV lithography machines, securing two units instead of one. The move signals Intel’s commitment to advancing its upcoming 14A process node, a critical milestone for its manufacturing roadmap.
The “Holy Grail” of Chipmaking #
ASML’s High-NA EUV systems are often called the “holy grail” of semiconductor manufacturing. Priced at around $370 million per unit, they deliver higher resolution and smaller feature sizes compared to Low-NA EUV, enabling progress toward 2nm and beyond.
Intel sees the 14A node as pivotal for the success of Intel Foundry Services (IFS). It will be the company’s first node to fully rely on High-NA EUV. Industry analysts estimate Intel could spend $1–2 billion on lithography equipment alone to secure its position in next-gen chip manufacturing.
Industry Allocation and Competition #
Latest allocation data shows global High-NA EUV orders for CY27E rising from 8 to 10 units. Intel increased its share from 1 to 2 units, while Samsung and SK Hynix each added one. Intel is also boosting its Low-NA EUV orders from 3 to 5 units, catching up to TSMC and Samsung in advanced lithography capacity.
- Samsung is expected to deploy High-NA EUV commercially by late 2025.
- TSMC is planning a slower rollout.
- Intel’s 14A node could become the first large-scale application of High-NA EUV, giving it a potential early lead if successful.
However, Intel’s track record of delays at 10nm and 7nm looms large, making the execution of 14A a true test of its manufacturing credibility.
Strategic Stakes for Intel and the U.S. #
Intel’s progress in advanced nodes is not just about business—it’s also a matter of U.S. semiconductor competitiveness. Successful deployment of 18A and transition to 14A will directly shape the company’s foundry strength and its role in the global supply chain.
The next two years will be the defining window:
- Success could restore Intel’s place in leading-edge manufacturing.
- Failure could risk ceding further ground to rivals in the semiconductor technology race.