It’s no secret that Qualcomm is ramping up its push into the desktop computing market. Recently, details about its next-generation Snapdragon X2 desktop CPU have begun to emerge. This chip will leverage the advanced Oryon V3 architecture, boasting up to 18 cores and promising performance that significantly outstrips current laptop processors. Alongside this, Qualcomm plans to integrate memory and storage directly into the chip package via a unique System-in-Package (SiP) design, delivering a fresh experience for desktop platforms.
The Snapdragon X2 builds on the success of the Snapdragon X Elite in the mobile space. Unlike mainstream Intel and AMD processors, this desktop CPU stands out with its unconventional design. Reports indicate its top-tier configuration will feature 18 Oryon V3 cores—a big leap from the 12-core setup of the first-generation Snapdragon X Elite. Oryon V3, Qualcomm’s third-generation custom CPU architecture, brings notable performance gains over its predecessors. Leaked benchmark data suggests a 30% boost in single-core performance compared to the second generation, with even stronger multi-core results, making it well-suited for demanding desktop tasks like video editing, 3D rendering, and multithreaded applications.
What’s truly eye-catching is the Snapdragon X2’s SiP packaging technology. Qualcomm intends to embed 48 GB of RAM and a 1 TB SSD directly into the CPU package, moving away from traditional external components. This approach echoes AMD’s 3D V-Cache technology, which stacks L3 cache to enhance performance, but Qualcomm takes it further by integrating memory and storage onto the chip itself. This could reduce data transfer latency, boost system efficiency, and improve thermal management. That said, the manufacturing complexity and cost of SiP might pose challenges, and its real-world impact remains to be seen.
Codenamed “Project Glymur,” the Snapdragon X2 entered testing as early as Q3 2024. Internal data reveals Qualcomm tested the chip on a device with a 120mm all-in-one liquid cooler, hinting at high cooling demands and suggesting power and performance potential far beyond mobile-grade chips. A leaked shipping manifest also uncovered a premium variant dubbed “Snapdragon X2 Ultra Premium,” with part number X2-000-096. This “ultra-high-end” model may target professionals and enthusiasts, positioning it as a rival to AMD’s Ryzen 9 or Intel’s Core i9 series.
The Snapdragon X2 is said to support 12 memory channels—a 50% increase over the first-gen Snapdragon X—potentially delivering memory bandwidth of 136 GB/s or higher. This will enhance multitasking and the performance of large-scale applications. The chip will also integrate an Adreno GPU and an upgraded Hexagon NPU, bolstering graphics and AI computing power. For instance, its NPU could outpace the Hexagon NPU in the Snapdragon 8 Gen 1 Supreme by several times, enabling local execution of AI models with over 13 billion parameters—ideal for desktop generative AI applications.
Market positioning is another key focus. Qualcomm plans to launch the Snapdragon X2 in the second half of 2025, possibly around the Computex trade show. Pricing for the first-gen Snapdragon X laptops dipped as low as $700, and the desktop version might follow suit, targeting a $600–$1,000 range to appeal to a broad audience. The “Ultra Premium” model, however, could aim for the high-end market, nearing $1,500 to compete with flagship desktop processors.
To ensure the Snapdragon X2’s edge, Qualcomm is investing in ecosystem support. The chip will natively run Windows 12 and be optimized for compatibility with mainstream software like DaVinci Resolve for video editing. It may also feature multiple USB 4.0 ports and DP 1.4 display outputs, supporting up to three 4K monitors or two 5K displays—meeting the needs of professional creators.
Despite its impressive specs, the Snapdragon X2 faces hurdles. Qualcomm is still a newcomer in the PC market, and while its first-gen Snapdragon X series led in power efficiency, it lagged behind AMD’s Strix Point APU and Intel’s Lunar Lake chips in raw performance. Those competitors excel in GPU power and gaming, areas where Qualcomm must close the gap with Oryon V3 and SiP tech. Plus, the complexity of SiP manufacturing could drive up costs, potentially slowing market adoption.
Qualcomm hasn’t officially unveiled the Snapdragon X2’s full specs or release date yet. But as testing progresses and leaks pile up, the chip’s profile is coming into focus. It’s not just a sign of Qualcomm’s desktop ambitions—it could reshape the PC market’s competitive landscape. Tech enthusiasts should keep an eye out; 2025 might usher in a new hardware revolution.