TSMC has confirmed its initial list of N2 process customers, which includes Apple, MediaTek, and AMD. Industry reports also note that NVIDIA paid a premium to secure early A14 capacity for 2026–2027. The notable absence is Intel, which has relied on TSMC’s 6nm, 5nm, and 3nm for GPUs, SoCs, and CPU modules in recent years. By skipping N2, Intel signals strong confidence in its in-house 18A process.
N2 vs 18A: Competing Paths in Process Technology #
- TSMC N2: its first large-scale nanosheet architecture, improving density and power efficiency.
- Intel 18A: introduces RibbonFET (Intel’s GAAFET) plus PowerVia (backside power delivery). RibbonFET enhances transistor control, while PowerVia cuts resistance and crosstalk by separating power and signal wiring.
Together, these technologies reflect Intel’s bold approach to “performance per watt” gains, in contrast with TSMC’s evolutionary roadmap.
Strategic and Geopolitical Stakes #
Intel plays a pivotal role in U.S. semiconductor independence. With Washington holding a 10% stake in the company and backing it via the CHIPS Act, reliance on TSMC for leading nodes would undercut its political positioning. Betting on 18A not only highlights Intel’s technological ambition but also aligns with U.S. national strategy.
Fabless rivals like AMD, NVIDIA, and Apple must secure TSMC’s most advanced nodes to maintain product cycles, while Intel leverages vertical integration as a differentiator.
The Risks of Going All-In #
This strategy carries high risks. AMD and NVIDIA booked N2 capacity years in advance as a safeguard. Intel has not. That suggests confidence, but also leaves little room for error if 18A yields falter. CFO David Zinsner admitted to early yield setbacks, though production recovery appears underway.
Intel’s roadmap on 18A includes:
- Panther Lake (laptops)
- Diamond Rapids (servers)
- Nova Lake (up to 52-core desktop leadership attempt)
In parallel, AMD Zen 6 is rumored to debut on TSMC’s N2P/N2X with up to 24 cores and 7 GHz clocks.
High-Stakes Gamble #
Intel’s absence from N2 bookings is a doubling down on 18A. Success with RibbonFET and PowerVia could restore Intel’s credibility in process leadership and rebalance competition with AMD and NVIDIA. Failure, however, could cement rivals’ advantages with TSMC’s mature N2 technology.
For Intel’s leadership team, 18A is no longer just another node—it is the company’s comeback bet.