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Broadcom Launches Jericho 4: A Breakthrough 3nm Ethernet Chip

·327 words·2 mins
Broadcom 3nm Jericho 4 Distributed AI
Table of Contents

On August 4, 2025, U.S. semiconductor giant Broadcom officially introduced its latest Ethernet routing chip, Jericho 4. Built using TSMC’s cutting-edge 3nm process, Jericho 4 is engineered to support massive, cross-data-center AI infrastructure, boasting 200G PAM4 signaling and an innovative 3.2Tbps HyperPort for ultra-high-speed connectivity.


🔧 Key Features & Innovations
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⚙️ Advanced 3nm Process
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Leveraging TSMC’s 3nm manufacturing, Jericho 4 achieves superior integration and efficiency. The result is increased bandwidth and reduced power consumption for next-gen network systems.

🔗 Massive Interconnect Capacity
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Each Jericho 4-based system can connect over 1 million XPUs, enabling large-scale, collaborative computing across multiple data centers—multiplying the capabilities of previous solutions.

🚀 Industry-Leading Bandwidth
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With 51.2 Tbps total throughput, the chip introduces 3.2T HyperPort technology, merging four 800GE links into a single logical port. This eliminates traditional load balancing inefficiencies and boosts link utilization by up to 70%.

Broadcom 3nm Jericho 4

🌐 Long-Distance Lossless Transmission
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Through deep buffering and smart congestion management, Jericho 4 enables lossless RoCE (RDMA over Converged Ethernet) over distances up to 100 km—crucial for distributed AI deployments that span across geographies.

Broadcom 3nm Jericho 4

🔒 End-to-End Encryption at Wire Speed
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Each port is equipped with MACsec encryption, ensuring secure data transfers between data centers—without compromising throughput even under full load.

✅ UEC Standard Compliance
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Jericho 4 is fully aligned with the Ultra Ethernet Consortium (UEC) standard, ensuring seamless compatibility with UEC-certified NICs, switches, and software environments.

Broadcom 3nm Jericho 4


🧠 The Complete Ethernet AI Platform
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With Jericho 4, Broadcom completes its AI-optimized Ethernet solution stack:

  • Jericho 4: High-speed interconnect across data centers.
  • Tomahawk 6: 100Tbps backbone for intra-data center clusters.
  • Tomahawk Ultra: Sub-400ns ultra-low latency for inter-XPU communication.

Broadcom 3nm Jericho 4


📦 Market Availability & Outlook
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Sampling of Jericho 4 began in early August, with broad commercial deployment expected within the next nine months. As AI workloads scale, Jericho 4 is positioned to become a cornerstone of secure, high-performance, distributed AI networks, marking a shift toward more distributed, user-proximate data center architectures.

Broadcom 3nm Jericho 4

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