Recent rumors within the industry suggest that AMD’s next-generation Zen 6 processors and UDNA graphics cards will utilize the advanced N3E process technology. Additionally, 3D stacking technology will be further extended to the Halo and next-generation gaming console APUs.
According to information shared by Chiphell forum member @Zhangzhonghao, AMD’s next-gen products will see further improvements in performance and efficiency. The Ryzen “Zen 6” series, codenamed Medusa Ridge, will feature Zen 6 CCDs manufactured on the N3E process. These CPUs will come with an upgraded I/O die based on the N4C process node, which is a cost-effective version of the N4P process. This I/O die upgrade will bring superior I/O performance and integrated graphics capabilities compared to Zen 5.
The Medusa desktop CPUs are expected to maintain compatibility with the AM5 socket and are planned for release in late 2026 or early 2027. The new CPUs will use a single CCD, with the core count increasing to 32, which is double that of the Zen 4 CCD. This boost will enhance multitasking and overall performance.
On the GPU front, AMD plans to introduce the next-generation UDNA series, which will officially replace the existing RDNA and CDNA series. Rumors suggest that the UDNA architecture will be based on TSMC’s N3E process technology. This unified architecture could bring higher performance and lower power consumption to Radeon graphics cards. The UDNA series is expected to begin mass production in the second quarter of 2026 and will be integrated into next-gen gaming consoles, including the PS6.
In addition to processor and graphics card upgrades, AMD will also update its 3D stacked product portfolio, offering new SKUs for the next-gen Halo APU series. Sony is also preparing to adopt AMD’s 3D stacking technology for its new gaming console. Although specific packaging details have not been announced, the industry expects that 3D stacking will combine different core IP stacks with 3D V-Cache technology, which is projected to significantly boost performance and energy efficiency.
According to AMD’s roadmap, the company will introduce next-generation products across multiple segments in the coming years. The Zen 6 architecture will not only be used in desktop CPUs but will also extend to the server and high-end desktop markets. Meanwhile, UDNA architecture graphics cards will cover a wide range of needs from mainstream to high-end, ensuring AMD maintains its position in the highly competitive GPU market.
This year, AMD has launched several powerful products in the mobile sector, receiving a positive market response. With the transition to the next-generation Zen 6 and UDNA architectures, AMD is poised to redefine PC and gaming console performance between 2025 and 2027. In the coming years, AMD is expected to continue exerting significant influence in the global IT market through these innovative products.